Laird Technologies
Laird Performance Materialsは、EMI抑制、熱管理材料、構造・精密金属、複合機能製品など、電子機器保護ソリューションの設計・開発を行っています。材料科学の専門家により、保護性能の向上、性能と信頼性の強化、カスタム構造設計、開発期間の短縮を実現します。
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Laird Technologies Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.2024/09/10 -
Laird Technologies Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.2024/09/10 -
Laird Technologies BMI-S-608 Shield FrameOne-part shielding solution with a stainless-steel design and without a top-mount cover.2024/06/10 -
Laird Technologies ReZorb™ S MM Wave Elastomer AbsorbersPure dielectric silicone absorbers with no magnetic properties.2024/01/09 -
Laird Technologies Eccosorb™ RF-RET Broadband Foam AbsorbersLightweight open-celled reticulated foam absorbers that offer 20dB performance ratings.2023/12/22 -
Laird Technologies RobZorb® GDS Dispensable Elastomeric AbsorbersDesigned for optimum performance over an 18GHz to 35GHz frequency range.2023/10/20 -
Laird Technologies NA12065 Steward™ Nanocrystalline SheetsProvide high-permeability solution for EMI mitigation over a frequency range from 100KHz to 100MHz.2023/10/11 -
Laird Technologies CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.2023/09/08 -
Laird Technologies NoiseSorb NS1000HTRC Noise Suppression AbsorbersExcellent temperature stability, a 0.1mm thickness, and a 20MHz to 3GHz effective frequency range.2023/05/04 -
Laird Technologies Eccosorb™ RF-LW Microwave AbsorbersOffers high attenuation for cavity-resonance problems and surface-current attenuation.2022/12/22 -
Laird Technologies Eccosorb™ RF-LB EMI Noise Suppression AbsorbersSilicone-based elastomeric absorber with an improved low-frequency filler system.2022/12/13 -
Laird Technologies CMA0805 Automotive Common Mode ChokesCompact, low 1.20mm profile, ideal for automotive electronics, industrial, & telecom applications.2022/10/27 -
Laird Technologies Eccosorb JCS-NextDielectrically loaded silicone absorber, targeting high-frequency noise above 30GHz.2022/10/24 -
Laird Technologies MHAH High-Temperature Molded SMD Power InductorsImproves consumer electronics and telecom designs' performance, reliability, and efficiency.2022/10/11 -
Laird Technologies CPI0603 Multilayer Ferrite Chip Power InductorsRobust, small-sized structures that allow for higher mounting density.2022/09/26 -
Laird Technologies IWC SMD Wirewound Ceramic Chip InductorsFeature high resonance frequencies and narrow inductance tolerances (±2% or ±5%).2022/09/26 -
Laird Technologies Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.2022/08/03 -
Laird Technologies Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.2022/08/03 -
Laird Technologies Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.2022/07/19 -
Laird Technologies Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.2022/06/03 -
Laird Technologies Fabric-Over-Foam (FoF) 51G EMI GasketsFeature >100dB shielding effectiveness across a wide spectrum of frequencies.2022/05/10 -
Laird Technologies Fabric-Over-Foam (FoF) 221 EMI GasketsProvide excellent EMI shielding performance for users where EMI issues occur.2022/05/10 -
Laird Technologies Tflex™ RB300 Thermal Gap FillerExceptionally soft gap filler pads with a thermal conductivity of 1.2 W/mK.2022/03/30