すべての結果 (1,058)

モジュール上コンピュータ - COM JUMPtec COMe-bBD7R E2 D-1539 10G-KR

モジュール上コンピュータ - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.

モジュール上コンピュータ - COM QSEVEN INTEL ATOM E3845 BAY TRAIL

ヒートシンク HSP COMe-bSL6 Cu-core threaded

開発基板およびキット - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

ヒートシンク Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

モジュール上コンピュータ - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

開発基板およびキット - x86 COMe Eval Carrier 2 T10

モジュール上コンピュータ - COM COMe-bTL6 W-11865MLE RM590E

モジュール上コンピュータ - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

モジュール上コンピュータ - COM QSEVEN INTEL ATOM E3815 BAY TRAIL

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).