すべての結果 (1,058)

モジュール上コンピュータ - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

CPU & チップクーラ COMe Active Uni Cooler (w/o HSP)

モジュール上コンピュータ - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. DisplayPort interface instead of LVDS. Commercial temperature ran

モジュール上コンピュータ - COM Q7 INTEL ATOM E3845 BAY TRAIL COM TEMP

ヒートシンク Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0

モジュール上コンピュータ - COM JUMPtec COMe Mount Kit 8mm 1set

長方形ケーブルアセンブリ Cable for Backlight with JST ZHR-8 connector, 50cm, Open End, matches with conga-JC370.

コンピューターケーブル RS232 console adaptor cable

CPU & チップクーラ * Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

モジュール上コンピュータ - COM JUMPtec COMe-mAL10 E2 E3940 4E

モジュール上コンピュータ - COM headless Intel Atom E3805 dual core processor, 1.33GHz, 1MB L2 cache, 2GB 1067MT/s DDR3L onboard single channel memory and 4GB eMMC onboard flash Industrial grade temperature range from -40 C to 85 C

CPU & チップクーラ Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.