すべての結果 (1,058)

ヒートシンク * Standard heat spreader for SMARC 2.0 module conga-SA7* For modules with open-die Intel Pentium/Celeron processor* All stand-offs are with 2.7mm bore hole

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i7-1185G7E 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel Iris Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Commercial t

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Celeron 6305E 2-core processor with 1.8GHz, 4MB cache, Intel UHD Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Commercial temperature range.

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel Iris Xe Graphics with 80EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial te

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Celeron 6305E2-core processor with 1.8GHz, 4MB cache, Intel UHD Graphics with 48EU and 4 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Commercial temperature range.

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel UHD Graphics with 48EU and 8 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial t

CPU & チップクーラ Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

CPU & チップクーラ Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.

ヒートシンク Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded V2718 8-core processorwith 1.7GHz up to 4.15GHz boost freq., 4MB L2 cache, Radeon Vega Graphics with 7 CU and dualchannel DDR4 3200 MT/s memory interface with ECC support. Commercial tem

モジュール上コンピュータ - COM COM HPC Size A module with Intel Core i7-1185G7E Processor, quad core with 2.8GHz (up to 4.4GHz), 12MB L2 cache, GT96 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP).

モジュール上コンピュータ - COM COM HPC Size A module with Intel Core i3-1115G4E Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP).