すべての結果 (1,058)

ヒートシンク Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.

CPU & チップクーラ Standard passive cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 18.2mm overall cooling height.

ヒートシンク Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm.

モジュール上コンピュータ - COM COM-HPC Size A module based on Intel Core i3-1220PE processor with 4 P-cores 1.5GHz up to 4.2GHz and 4 E-cores 1.1GHz up to 3.1GHz, 12MB Intel Smart Cache, Intel UHD Graphics with 48EUs, Dual channel DDR5 4800 MT/s memory interface, Intel code n

モジュール上コンピュータ - COM COM-HPC Size A module based on Intel Core i5-1250PE processor with 4 P-cores 1.7GHz up to 4.4GHz and 8 E-cores 1.2GHz up to 3.2GHz, 12MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 80EUs, Dual channel DDR5 4800 MT/s memory interfa

モジュール上コンピュータ - COM COM-HPC Size A module based on Intel Core i3-1215UE processor with 2 P-cores 1.2GHz up to 4.4GHz and 4 E-cores 0.9GHz up to 3.3GHz, 10MB Intel Smart Cache, Intel UHD Graphics with 64EUs, Dual channel DDR5 4800 MT/s memory interface, Intel code n

CPU & チップクーラ Starterkit for SMARC 2.0 with SMARC module based on Intel Atom E3900 processor series. Includes congatec SMARC evaluation carrier board conga-SEVAL, SMARC module conga-SA5, cooling solution, adapters and cables.

CPU & チップクーラ Passive cooling solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Celeron 7305E processor with 1 P-core 1.0GHz and 4 E-cores 0.9GHz, 8MB Intel Smart Cache, Intel UHD Graphics with 48EUs, Dual channel DDR5 4800 MT/s memory interface, Intel code name Alder Lake-U

CPU & チップクーラ Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.

CPU & チップクーラ Standard passive cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.

ヒートシンク Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded.