congatec サーマルマネジメント

ヒートシンク Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread.

ヒートシンク Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM processor. All standoffs are with 2.7mm bore hole.

ヒートシンク Standard active cooling solution for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370 with heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.

CPU & チップクーラ Standard active cooling solution for high performance COM Express Type 7 module conga-B7XD with integrated heat pipes, 70mm radial FAN and 30mm overall heat sink height. All stand-offs are M2.5mm threaded.

ヒートシンク Standard heatspreader with Vapor Chamber for high performance COM Express Type 7 module conga-B7XD. All stand-offs are with 2.7mm bore hole.

ヒートシンク HSP COMe-mRP10 Cu-core through

CPU & チップクーラ HSP COMe-cTL6 Cu-core threaded - 90

ヒートシンク HSP COMe-bRP6 Cu-core through

ヒートシンク HSP SMARC-sXAL4

CPU & チップクーラ Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU & チップクーラ Standard passive cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole.

ヒートシンク Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole.